Press Corner

MULT-FUN at FORMNEXT 2022

We were at the 3D ADDITIVE EXPO

MULTI-FUN “The Future of Standardisation”

MULTI-FUN was at the I-AM Conference

Project Review Meeting with the EC

MULTI-FUN SpeedTech forum was a success

Innovation Workshop
.

Consortium Meets Presentially in Salzburg

MULTI-FUN at ISO/TC 261
.

Nosafety and responsible innovation

SAVE THE DATE!
Speedtech-Forums

MULTI-FUN
at the
IndTechDays 2022

MULTI-FUN at the Nanotech Conference in Paris

MULTI-FUN 2nd Newsletter is now Available!

MULTI-FUN Article published

MULTI-FUN Work Package 7 Interview

MULTI-FUN General Assembly Meeting

MULTI-FUN Work Package 6 main objectives

MULTI-FUN Work Package 5 main objectives

MULTI-FUN Presentation at the IIW 2021 Annual Assembly

Check out our latest intreview regarding WorkPackage 4

Consortium meeting for the first assessment with the European commission

MULTI-FUN project has been presented today at the 74th IIW Annual Assembly

Now available! Interviews related to the development of WP3

The latest interviews related to the development of WP2

MULTI-FUN first newsletter has just been released! Be sure to check it out!

Thanks to ISQ team for joining us on this interview!

Our first white board animation is here!!

Have a look and see why we are implementing in MULTI-FUN

MULTI-FUN's latest interactions with standardisation activities

Did you know that STANDARDISATION is one of the MULTI-FUN key results?

Did you know that MULTI-FUN project liaises with the AM Platform?

The AM-platform is the largest and oldest community...

The 73rd IIW Annual Assembly and International Conference IIW2020

Looking at the glass half-full?

TWENTY ONE EUROPEAN PARTNERS JOIN FORCES TO ADVANCE MULTI-MATERIAL 3D PRINTING

Twenty one industrial and research partners from